fig14

Recent progress in pressure and temperature tactile sensors: principle, classification, integration and outlook

Figure 14. (A) A modified electrical grounding circuit and designed PCB board for 32 × 32 piezoresistive tactile arrays. This figure is quoted with permission from Luo et al.[64]. (B) Signal process circuit for the capacitive bimodal tactile sensor array. This figure is quoted with permission from Chen et al.[13]. (C) Designed readout circuit for fingerprint sensor. This figure is quoted with permission from An et al.[65].

Soft Science
ISSN 2769-5441 (Online)
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