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  • Youth Editorial Board
    • (Listed in alphabetical order of the last name)

    • Mahdi Bodaghi
      Department of Engineering, School of Science and Technology, Nottingham Trent University, Nottingham, UK.
      Research Interests: Mechanics of materials; Smart materials; Soft matters; Meta-materials; Soft robotics; Additive manufacturing; 4D printing technology; Machine learning
    • Changyong Cao
      Department of Mechanical & Aerospace Engineering, Case Western Reserve University, OH, USA.
      Research Interests: Soft materials; Soft electronics; Soft robotics; 3D/4D printing; Printed electronics; Solid mechanics
    • Huipeng Chen
      School of advanced manufacturing, Fuzhou University, Fuzhou, Fujian, China.
      Research Interests: Flexible and stretchable electronics; Transistors; Sensors; Memory; Artificial synapse
    • Ying Chen
      Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China.
      Research Interests: Flexible electronic technology; Stretchable electronics; Skin-like sensors
    • Weili Deng
      School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu, Sichuan, China.
      Research Interests: Flexible electronics; Wearable devices; Piezoelectric/piezoresistive sensors; Functional materials
    • Kai Dong
      Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing, China.
      Research Interests: Smart textiles; Triboelectric nanogenerators; Self-powered sensing; Flexible and wearable electronics; Mechanical energy harvesting; Mechanical-to-electric conversion fibers; Flexible pressure sensors; Fiber electronic skins
    • Dongdong Han
      College of Electronic Science and Engineering, Jilin University, Changchun, Jilin, China.
      Research Interests: Laser technologies; Carbon-based MEMS; Flexible electronics
    • Tae Hee Han
      Department of Organic and Nano Engineering, Hanyang University, Seoul, Korea.
      Research Interests: Carbon nanomaterials; Functional fibers; Soft ionic materials
    • Hailong He
      Power Equipment Department of Electrical Engineering, Xi'an Jiaotong University, Xi'an, Shaanxi, China.
      Research Interests: Thermoelectric power systems; Thermoelectric modules and materials; Energy harvesting technology; Autonomous sensors; Wearable electronics; Liquid metal techniques
    • Mokarram Hossain
      Department of Engineering, Swansea University, Swansea, UK.
      Research Interests: Soft, responsive, and smart materials; 3D printing of soft materials; Experimental mechanics
    • Yong Hu
      School of Materials Science and Engineering, Tongji University, Shanghai, China.
      Research Interests: Soft hydrogels; Bioinstructive materials; DNA nanotechnology; Microfluidic droplet technology; Biointerfaces; Nanomedicine
    • Yougen Hu
      Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, China.
      Research Interests: Wearable, flexible, stretchable sensor; Tactile pressure sensors; Flexible printed electronics; Soft and hybrid electronics; Electronic packaging materials; Functional nano materials; EMI shielding materials; Microwave absorbing materials
    • Zheng Jia
      School of Aeronautics and Astronautics, Zhejiang University, Hangzhou, Zhejiang, China.
      Research Interests: Mechanics of hydrogels; Conductive hydrogels and elastomers; Hydrogel devices and machines; Hydrogel adhesives; Soft ionotronics
    • Qinglin Jiang
      State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou, Guangdong, China.
      Research Interests: Organic thermoelectric materials; Wearable thermoelectric devices
    • Yiju Li
      Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, China.
      Research Interests: Natural polymer materials; Polymer-based electrolytes; Flexible and wearable energy storage devices; Interfacial solar evaporation; Water electrocatalysis
    • Yuhang Li
      Institute of Solid Mechanics, Beihang University, Beijing, China.
      Research Interests: Stretchable electronics; Heat transfer; Mechanics of materials; Thermo-mechanical analysis
    • Ji Liu
      Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
      Research Interests: Soft materials engineering; Bioinspired design and fabrication; Soft materials mechanics; 3D printing; Biomaterials and soft electronics
    • Mingchao Liu
      School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore.
      Research Interests: Dynamic instabilities; Slender structures;  Mechanical metamaterials; Shape-morphing structures; Soft robotics
    • Deepa Madan
      Department of Mechanical Engineering, University of Maryland, Baltimore, MD, USA.
      Research Interests: Flexible electronics; Flexible batteries; Flexible thermoelectric generator
    • Ivan Rusev Minev
      Department of Automatic Control and Systems Engineering, University of Sheffield, Sheffield, UK.
      Research Interests: Conductive hydrogels; Conductive polymers; Electronic tissues; Neural interfaces; Electrode arrays; Bioelectronics
    • Changhyun Pang
      School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
      Research Interests: Nanostructures; Adhesion; Biomimetics; Soft electronics
    • Young-Geun Park
      Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
      Research Interests: Wearable electronics; 3D printing; Bioelectronics
    • Li Peng
      Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, Zhejiang, China.
      Research Interests: Graphene nanofilm; Polymer; THz sensor; Photodetector; Thermal management; Composite material; Catalyst
    • Hoang-Phuong Phan
      School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney. NSW, Australia.
      Research Interests: Semiconductor nanomembranes; Wearable acoustic sensors; Implanted sensors; Biodegradable material
    • Wooyoung Shim
      Department of Materials Science and Engineering, Yonsei University, Seoul, Korea.
      Research Interests: Low-dimensional materials; Ionic conductors
    • Yipin Su
      Department of Engineering Mechanics, Zhejiang University, Hangzhou, Zhejiang, China.
      Research Interests: Elastic waves; Instability analysis; Non-linear elasticity; Dielectric elastomers; Bifurcation
    • Ady Suwardi
      Institute of Materials Research and Engineering, National University of Singapore, Singapore, Singapore.
      Research Interests: Flexible substrates; 3D printing; Thermoelectrics
    • Shiyang Tang
      Department of Electronic, Electrical and Systems Engineering, School of Engineering, University of Birmingham, UK.
      Research Interests: Liquid metals; Microfluidics; Soft materials; Conductive composites; MEMS, Biosensors; Nanoparticles
    • Ye Tian
      College of Medicine and Biological Information Engineering, Northeastern University, Shenyang, Liaoning, China.
      Research Interests: Microfluidics; Functional fibers; Soft matter; Flexible electronics
    • Xuewen Wang
      Institute of Flexible Electronics (IFE), Northwestern Polytechnical University, Xi'an, Shaanxi, China.
      Research Interests: Flexible sensing materials; Flexible sensor system; 2D materials; Flexible mechanical sensors
    • Yao Wang
      School of Materials Science and Engineering, Beihang University, Beijing, China.
      Research Interests: Hybrid materials; Thermoelectric; Dielectric; Piezoelectric; Wearable sensors; Electrostatic energy storage
    • Yew Hoong Wong
      Department of Mechanical Engineering Faculty of Engineering, University Malaya, Kuala Lumpur, Malaysia.
      Research Interests: Electronic materials; Semiconductors; Electronic packaging materials; Gas sensors; Gate dielectric; Functional nanomaterials
    • Lin Xu
      School of Chemistry and Materials Science, Nanjing Normal University, Nanjing, Jiangsu, China.
      Research Interests: Electrocatalysis; Fuel cell; Metal-air battery; Water splitting; Energy conversion device; Energy materials; Functional nanomaterials
    • Xinge Yu
      Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
      Research Interests: Skin-integrated electronics; Haptic interfaces; Bio-integrated electronics; human-machine interfaces; Biomedical engineering
    • Libing Zhang
      Department of Chemistry, Tianjin University, Tianjin, China.
      Research Interests: Biotemplated nanomaterials; Biomolecular sensors; DNA Nanotechnology; Intracellular molecular delivery
    • Yichuan Zhang
      School of Chemistry and Chemical Engineering, Southwest University, Chongqing, China.
      Research Interests: Wetting; Contact angle; Carbon nanotubes; Thermoelectric composite; Conductive polymer composites
    • Jianwen Zhao
      Department of Mechanical Engineering, Harbin Institute of Technology, Weihai, Shandong, China.
      Research Interests: Soft robotics; Soft sensing
    • Zeang Zhao
      Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing. China.
      Research Interests: Mechanics of soft materials; Additive manufacturing of polymers; Designing of architecture materials
    • Hai Zhong
      Institute of New Energy Technology, Jinan University, Guangdong, China.
      Research Interests: Flexible rechargeable batteries; Electrochemistry; Materials chemistry
    • Jianxiong Zhu
      School of Mechanical Engineering, Southeast University, Nanjing, Jiangsu, China.
      Research Interests: Soft materials; Wearable sensors; IoTs; Human-machine interface; Micro and nano system
    • Pingan Zhu
      Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China.
      Research Interests: Microfluidics; Fluid dynamics; Surface wettability; Micro/nanorobots; Biomimetics
    • Ali Zolfagharian
      School of Engineering, Deakin University, VIC, Australia.
      Research Interests: Shape memory materials; Smart materials; Soft robots; 3D/4D printing

    All members of the Editorial Board have identified their affiliated institutions or organizations, along with the corresponding country or geographic region. OAE Publishing Inc. remains neutral with regard to any jurisdictional claims.

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