fig3

Figure 3. The preparation process and microstructure characterization of LM-elastomer composites. (A) The overview of processes for preparing LM inclusion composites. Reproduced with permission^[61]. Copyright 2020, John Wiley and Sons; (B) Photograph of a kind of LM-elastomer composite for printing circuits. Reproduced with permission^[62]. Copyright 2019, American Chemical Society; (C) An LM composite with self-healing performances being stretched and twisted. Reproduced with permission^[60]. Copyright 2018, The Authors; (D) A schematic illustration of mechanisms in electrical transition between insulative and conductive LM composites to temperature change. Reproduced with permission^[63]. Copyright 2019, John Wiley and Sons; (E) Microstructure characterization of LM-elastomer composites with anisotropic and unconventional piezoconductivity. Reproduced with permission^[64]. Copyright 2020, Elsevier. EGaIn: Eutectic Ga-In; LM: liquid metal; PDMS: polydimethylsiloxane; RPM: revolutions per minute.