fig4

Figure 4. Overview of interconnect materials of pressure and temperature sensors towards e-skin. (A) All-printed, interdigitated, and freestanding serpentine interconnect-based flexible solid-state supercapacitors for self-powered wearable electronics. Reproduced with permission^[45]. Copyright 2019, Elsevier B.V. (B) Metallic and non-metallic interconnect materials. Reproduced with permission^[47-52]. Copyright 2020, Springer Nature^[47]. Copyright 2020, John Wiley & Sons, Inc^[48]. Copyright 2022, Springer Nature^[49]. Copyright 2011, Springer Nature^[50]. Copyright 2022, MDPI^[51]. Copyright 2017, American Association for the Advancement of Science^[52]. (C) Graphene/silver nanowire hybrid fillers on highly stretchable strain sensors based on spandex composites. Reproduced with permission^[54]. Copyright 2020, MDPI. (D) Conductive hydrogel-based elastic microelectronics for localized low-voltage neuromodulation. Reproduced with permission^[55]. Copyright 2019, Springer Nature. (E) Wearable microfluidic diaphragm pressure sensors for health and tactile touch monitoring. Reproduced with permission^[56]. Copyright 2017, John Wiley & Sons, Inc.