fig1

Figure 1. Overview of recent progress in pressure and temperature tactile sensors in terms of principles, classification, and integration. Figure “piezoresistivity”, quoted with permission from Sundaram et al.^[9]; “capacitance”, quoted with permission from Park et al.^[11]; “piezoelectricity”, quoted with permission from Chen et al.^[13]; “triboelectricity”, quoted with permission from Wang et al.^[15]; “thermoresistivity”, quoted with permission from Shin et al.^[17]; “thermoelectricity”, quoted with permission from Li et al.^[19]; “piezo/thermoresistivity” (dual-parameter sensors), quoted with permission from Wang et al.^[30]; “piezoresistivity/thermoelectricity” (dual-parameter sensors), quoted with permission from Wang et al.^[35]; “piezo/thermoresistivity” (integrated bimodal sensors), quoted with permission from Jung et al.^[37]; “capacitivity/thermoresistivity”, quoted with permission from Wu et al.^[40]; “piezoresistivity/thermoelectricity” (integrated bimodal sensors), quoted with permission from Jung et al.^[42]; “piezo/thermoelectricity”, quoted with permission from Zhu et al.^[46]; “photovoltaics”, quoted with permission from Michaels et al.^[50]; “thermoelectrics”, quoted with permission from Michaels et al.^[50]; “supercapacitors”, quoted with permission from Wang et al.^[61]; “batteries”, quoted with permission from Pan et al.^[59]; “NFC”, quoted with permission from Han et al.^[62]; “BLE”, quoted with permission from Song et al.^[63]; “Signal process circuit”, quoted with permission from Luo et al.^[64].